Taiwan Semiconductor Manufacturing Company (TSMC) has announced its first ‘angstrom-class’ process technology: A16. This new 1.6nm-class production node will be the first to introduce a backside power delivery network technology (BSPDN) to TSMC’s chipmaking repertoire. The A16 process technology will rely on gate-all-around (GAAFET) nanosheet transistors and will feature a backside power rail, which will both improve power delivery and moderately increase transistor density. Compared to TSMC’s N2P fabrication process, A16 is expected to offer a performance improvement of 8% to 10% at the same voltage and complexity, or a 15% to 20% reduction in power consumption at the same frequency and transistor count. The new technology will be available to TSMC’s clients starting in the second half of 2026.
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