Samsung unveils new memory chip with 'highest-capacity to date' for AI

Samsung Electronics has developed a new high-bandwidth memory chip, HBM3E 12H, with the highest capacity to date in the industry. The chip raises both performance and capacity by more than 50%. This development is expected to meet the increasing demand for high-capacity memory in the AI era. The chip is particularly suited for AI service providers and is expected to reduce the total cost of ownership for datacenters. Samsung has started sampling the chip to customers and plans for mass production in the first half of 2024.

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